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GY-LSM6DS3 LSM6DS3 Accelerometer Gyro Embedded Digital Temperature Sensor Module SPI IIC I2C Interface Module 8kb FIFO Buffer and embedded processing interrupts designed specifically for the handset market. LSM6DS3 Breakout has been designed to be super-flexible and can be configured specifically for many applications
1. There may be slight size deviations due to manual measurement, different measuring methods, and tools.
2. The picture may not reflect the actual colour of the item because of different photographing light, angles, and display monitors.
This MPU6500 module integrates a 3-axis gyroscope, 3-axis accelerometer and DMP (Digital Motion Processor), all in one chip.
|Dimensions||1.2 × 1.8 cm|
Tempero Systems offers many custom IoT electronic design services to help tailor our product to your exact needs. Whether you are looking for custom firmware, circuit board modifications, metal enclosures, or industrial color printing, we can help you with a wide variety of design services.