BGA Reballing Universal Stencils
Universal direct heat BGA stencils for notebooks, desktops, communications motherboards and other graphics cards and other types of BGA chip
Out of stock
BGA Reballing Universal Stencils Direct Heat Steel Stencils for SMT SMD Notebook Motherboard Chip 36Pcs/set
Stencil List:
- W001 0.25mm P=0.50 A=32*32
- W002 0.30mm P=0.50 A=29*29
- W003 0.30mm P=0.60 A=18*18
- W004 0.30mm P=0.60 A=27*27
- W005 0.35mm P=0.60 A=23*23
- W006 0.35mm P=0.60 A=32*32
- W007 0.35mm P=0.65 A=26*26
- W008 0.35mm P=0.65 A=32*32
- W009 0.40mm P=0.80 A=19*19
- W010 0.40mm P=0.80 A=27*27
- W011 0.40mm P=0.80 A=33*33
- W012 0.45mm P=0.80 A=19*19
- W013 0.45mm P=0.80 A=33*33
- W014 0.45mm P=0.80 A=40*40
- W015 0.50mm P=0.80 A=19*19
- W016 0.50mm P=0.80 A=26*26
- W017 0.50mm P=0.80 A=33*33
- W018 0.50mm P=0.80 A=40*40
- W019 0.50mm P=0.80 A=50*50
- W020 0.55mm P=1.00 A=26*26
- W021 0.55mm P=1.00 A=36*36
- W022 0.60mm P=0.90 A=26*26
- W023 0.60mm P=0.90 A=35*35
- W024 0.60mm P=1.00 A=20*20
- W025 0.60mm P=1.00 A=32*32
- W026 0.60mm P=1.00 A=40*40
- W027 0.60mm P=1.00 A=47*47
- W028 0.60mm P=1.10 A=28*28
- W029 0.60mm P=1.10 A=47*47
- W030 0.65mm P=1.00 A=33*33
- W031 0.65mm P=1.10 A=36*36
- W032 0.76mm P=1.27 A=30*30
- W033 0.76mm P=1.27 A=37*37
- W034 0.76mm P=1.27 A=45*45
- W035 1.00mm P=1.50 A=45*45
- W036 0.40mm P=0.70 A=29*29
Attention:
A better solder ball has normal content of tin and silver. The melting point is normal.
Direct heat with an air gun, adjust the temperature. No need for too high temperature, otherwise cause deformation.
Specifications:
- Material: stainless steel plate
- Colour: Silver
Package included: BGA Reballing Universal Stencils 36pcs set
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Notes:
1. There may be slight size deviations due to manual measurement, different measuring methods and tools.
2. The picture may not reflect the actual colour of the item because of different photographing light, angles and display monitors.
Weight | 0.100 kg |
---|---|
Dimensions | 6 × 6 × 2 cm |